With two manufacturing plants located in Huizhou and northern Jiangxi Province, we have a combined manufacturing space of 110,000 m² (1,180,000 ft²). In addition to our state-of-the-art production facilities, we have dedicated buildings for engineering and reliability labs, waste and water treatment, as well as employee living and recreational facilities. Our team consists of over 500 employees as of Q1-2023.
Equipped with advanced machinery and equipment, we are capable of producing PCBs with up to 40 layers. Our manufacturing capabilities include cutting-edge technologies such as HDI, Stacked Microvias, Blind/Buried Vias, and Low Dk/Df Materials. These capabilities enable us to provide innovative solutions for various industries, including security and defense, industrial control, communication, medical instruments, and automotive electronics.
Our dedicated R&D team collaborates closely with customers and industry experts to develop and implement novel processes and materials. Through these collaborative efforts, we have garnered recognition and praise from clients worldwide.
At 1Link, we take pride in providing our customers with exceptional PCB assembly turnkey and PCB fabrication services. We are dedicated to delivering high-quality services, ensuring timely delivery, and offering a streamlined ordering process, all at competitive prices.
It comes as no surprise that we receive daily orders for PCBs from customers worldwide. Our ability to deliver over 10,000 varieties per month has established us as a trusted supplier in the industry. If you have a high-volume order, you can trust that we have the capacity to handle it.
The table below provides estimated delivery times for different PCB layer orders to your location.
| Placer Speed: | 6000 Chips/Hours |
|---|---|
| Lead time: | 25+Days (To Be Decided) |
| SMT: | SMT, Through Hole Assembly Single / Double-Side SMT, Single / Double-Sides Mixture Assembly. |
| PCB Size: | 50 mm×50 mm ~450 mm×406 mm |
| PCB Thickness: | 0.5mm~4.5mm |
| Min. Diameter / Space of BGA: | 0.2mm / 0.35mm |
| Qualifications: | ISO 9001:2008 |
| Accuracy: | <±40 µm, Under the Condition of 3σ,CPK≥1 |
| Min.Line / Track Width: | 3mil |
| Minimum Width / Space of QFP | 0.15mm / 0.3mm, Minimum Diameter / Space of BGA: 0.2mm/0.35mm |
| Reliability Test: | Flying Probe Test / Fixture Test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc. |
Automatic PCB Loader
Solder Printer
Solder Paste Inspector
Mounting Machine
Reflow Oven
Wave Soldering Machine
Lead Cutting Machine 02
Lead Cutting Machine.