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Equipment & Technology

Overview of the factory

With two manufacturing plants located in Huizhou and northern Jiangxi Province, we have a combined manufacturing space of 110,000 m² (1,180,000 ft²). In addition to our state-of-the-art production facilities, we have dedicated buildings for engineering and reliability labs, waste and water treatment, as well as employee living and recreational facilities. Our team consists of over 500 employees as of Q1-2023.

Equipped with advanced machinery and equipment, we are capable of producing PCBs with up to 40 layers. Our manufacturing capabilities include cutting-edge technologies such as HDI, Stacked Microvias, Blind/Buried Vias, and Low Dk/Df Materials. These capabilities enable us to provide innovative solutions for various industries, including security and defense, industrial control, communication, medical instruments, and automotive electronics.

Our dedicated R&D team collaborates closely with customers and industry experts to develop and implement novel processes and materials. Through these collaborative efforts, we have garnered recognition and praise from clients worldwide.

RIGID PCB CAPABILITIES

Materials FR4, High TG FR4, Halogen Free Material, CEM-3, Rogers HF Material, Aluminum
PTFE Laminates Rogers series, Taconic series, Arion series, Nelco series, Taizhou Wangling F4BK series, TP series.
Hyrid Laminating Rogers/Taconic/Arion/Nelco laminate with FR-4 material - including partial RO4350B hybrid laminating with FR-4
Layers 1 - 64 layers
Board Thickness: 0.1 - 10 mm
Soldermask Type (LPI) Kuangshun, Taiyo, Himonia, Nanya, Onstatic, Chung Yu, MSDS
Soldermask Color Green, Yellow, Black, Blue, Red, White, Purple, Orange, Matte green, Matte blue, Matte black
Surface Treatment HASL, HASL-LF, OSP, ENIG, ENEIPG, Hard gold, Gold finger
Min.Line/Track Width 3mil
Min.Mechanical Drill Hole 0.10mm
MIN.Drilling Slot Size 0.6mm
Copper Thickness 20oz MAX
Legend/Silkscreen Color Black, White, Yellow, and others.
Other Technology Peelable Mask, Carbon ink, Non-across Blindried Vias, Characteristic Impedance Control, VIA IN PAD etc.
HDI 1+N+1, 2+N+2, 3+N+3, Anylayer HDI.
Buried & Blind VIA 4 - 64 layers, 0.5 - 10mm (Board Thickness).

RIGID-FLEX PCB CAPABILITIES

  • Flex & Rigid-Flex PCBs
    1 - 10 layers Flex PCB & 2 - 20 layers Rigid-flex PCBs
  • FCCL (adhesive)
    Shengyi SF305, PI = 1mil and 2mil, Cu = 0.33oz & 0.5oz & 1oz
    Panasonic R-F5775(ER), PI = 1mil and 2mil, Cu = 0.33oz & 0.5oz & 1oz
    Dupont Pyralux AP, PI = 1mil and 2mil, Cu = 0.5oz & 1oz
  • Coverlay
    Shengyi SF305C & 0515 & 0525 & 1025 & 2030; Talflex FHK 1025 & 1035
  • NO FLOW PP
    Ventec: vt-47n(TG170) & em-285b(TG150)
  • CCL
    ITEQ: IT180A
    Shengyi: S1000H & S1000-2
    Arlon: 85N
    Nelco: N4000-13 series
  • Board Thickness
    0.3 - 3.0 mm
  • Board Size
    10mm * 15mm Min
    406.4mm * 558.8mm Max
  • Min. BGA pad size
    12mil (8mil for electrical soft gold board)
  • Surface Treatment
    HASL, HASL-LF, ENIG, ENEPIG, Hard Gold, Immersion silver, Immersion tin, OSP.
  • Bow & Twist
    0.75% (symmetrical)
  • Other Techniques:
    HDI
    Gold Fingers
    Stiffener (Only for PI / FR4 Substrate)

HDI PCB CAPABILITIES

  • Feature
    Capacity
  • HDI PCB type :
    1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm)
  • Blind&buried via type:
    mechanical blind&burried vias with less than 2 times laminating; Laser blind via
  • Min laser drilling size:
    4mil
  • Max laser drilling size:
    6mil
  • Finshed mechanical hole size:
    5-244mil(corresponding drilling tool size 8-248mil)
  • MAX aspect ratio for Hole plate:
    10:1
  • Max aspect ratio for laser via filling plating:
    0.9:1(Dpeth included copper thickness)
  • Min gap between hole wall and conductor (None blind and buried via PCB):
    7mil(≤8L),9mil(10-14L),10mil(＞14L)
  • Min gap between hole wall conductor (Blind and buried via PCB):
    8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)
  • Min gab between hole wall conductor (Laser blind hole buried via PCB):
    7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）
  • Min space between laser holes and conductor:
    6mil
  • Min space bwteen hole walls in different net:
    10mil
  • Min Pad size for laser drillings:
    10mil(for 4mil laser via),11mil(for 5mil laser via)
  • Min Pad size for mechanical drillings:
    16mil(8mil drillings)

The Different Types of HDI Printed Circuit Boards Structures

With the capacity to produce HDI PCBs of up to 32 layer，depending on the unique requirements of each project. Below is a table outlining the different types of HDI PCB structures we can create.

HDI PCB Structures The Various categories of
Micros Vias 		Large-Scale Production Small to Medium-Scale
Production 		Prototype Available
1+N+1 Blind vias Yes Yes Yes Over 4 layers
2+N+2 Blind/Buried staggered vias Yes Yes Yes Over 6 layers
2+N+2 Blind/Buried stacked vias Yes Yes Yes Over 6 layers
3+N+3 Blind/Buried stacked vias / Yes Yes Over 8 layers
3+N+3 Blind/Buried stacked vias / / Yes Over 8 layers

Advanced Equipments Show

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